Canteliver Probe Card
MPI Cantilever Probe Card is broadly used on gold bump and pad wafer tests for Display screen driver, logic, and memory device. MPI’s cantilever probes will be the corresponding remedy to your calls for of fine pitch, modest pad dimension, higher velocity, less cleansing, multi-DUT, large pin count, and ultra-reduced leakage requirements. With superb craftsmanship, revolutionary architecture and tested methodologies dependant on mechanical and electrical simulation/measurement benefits, creating MPI the highest cantilever provider around the globe.
FCB Probe Card
The FCB Probe Card is among the most experienced technological innovation of buckling beam probe card. It is aimed to realize the semiconductor ship manufacture time-to-market (TTM) and cost of examination (COT) demand from customers. FCB is really a established Alternative for a number of semiconductor creation tests from early engineering pilot-runs to substantial volume production (HVM). FCB is prepared for product demanding superior sign integrity probing (SI) and/or energy integrity probing (PI). Applications contain reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB ensures the entire world’s greatest All round Expense-of-ownership (COO) for various DUT purposes.
EVS Probe Card
The EVS Probe Card is an improvement above the conventional buckling beam probe card. Vital capabilities are increased existing carrying potential (C.C.C.) and decreased balanced Call power (BCF), in addition to overall MEMS-like features. EVS can easily meet up with the requirement of Highly developed wafer probing. Precise alignment and fantastic planarity Handle are the critical elements contributing to steady Call resistance. With its capacity and functionality, EVS Probe Card is a super choice for Superior probe cards.
Osprey probe card
The Osprey probe card is MPI’s Option to demand from customers for at any time finer pitch. It's designed for more compact Al pad, and is also perfect for little pitch application with peripheral and comprehensive array sample. With exact alignment and superior planarity Command, Osprey can arrive at better efficiency by multi-DUT style and design. The forming wire (FW) type needle created with MPI’s possess micro fabrication course of action not simply delivers substantial-good quality efficiency but additionally will allow quick needle replacement and shortens maintaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle that's suitable for the check here desire of very low drive probing. In addition it comes along with the opportunity to satisfy higher C.C.C. and large pin counts software. The MEMS course of action makes certain hugely regular needle attributes, as well as the Particular structure design permits specific alignment and planarity Management.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/
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